6 capabilities · 12 products
Predictive CFD and thermal-network modeling from board to full system. Build validated digital twins that expose hotspots, airflow shortfalls, and cooling margin before hardware exists.
Die-level and package-level thermal analysis for chiplets, interposers, and advanced 3D IC stacks. Understand junction temperature and stack-up thermal resistance before RTL freeze.
Board-level thermal design driven directly from ECAD. Evaluate component placement, copper distribution, via strategy, and heatsink sizing alongside routing decisions.
Non-destructive junction-to-ambient measurement, TIM characterization, and accelerated power-cycling. Turn measured device behavior into validated inputs for simulation.
Automated design-of-experiments and multi-objective optimization across thermal, weight, cost, and packaging constraints. Explore hundreds of variants without hand-driving each run.
Focused, outcome-based engineering engagements delivered by ESI thermal specialists. Model authoring, test-to-simulation correlation, and workflow enablement on defined timelines.
