Every Simcenter thermal tool, delivered by Electro Source.

Industry-leading CFD for accurate, efficient electronics thermal design — from PCB through enclosure and rack-level systems.

Accelerate product development through integrated, intuitive CFD simulation embedded directly in your CAD environment.

Multiphysics CFD for the thermal problems that general electronics-cooling tools were not built for — two-phase, immersion, radiation-dominant, moving parts, and coupled physics.

FE-based thermal simulation coupled with structural, acoustic and motion analysis inside NX. The tool of choice when thermal loads drive structural performance.

Multi-domain 1D simulation for architects who need to decide cooling strategy, HVAC topology, and battery TMS before CAD or controls exist.

1D simulation for cooling loops, HVAC, hydraulic circuits, and thermal-fluid systems — at the scale where 3D CFD is too slow to iterate.

Explore more design possibilities automatically and identify better trade-offs between thermal performance, weight, cost, and engineering constraints.

Junction-temperature analysis at the chiplet and die level — the layer where advanced-package thermal problems actually originate.

Where chiplets get placed, interposers get sized, and package thermal feasibility gets decided — before hundreds of engineer-months are committed.