From Junction to System: Owning the Complete Heat Path
How ownership of the thermal path from die to system-of-systems changes what engineering teams can decide, and when.
How ownership of the thermal path from die to system-of-systems changes what engineering teams can decide, and when.
The cost of finding thermal issues at prototype, qualification, and field — and how to shift the discovery earlier.
Using T3Ster, DynTIM, and Power Tester data to correlate Flotherm and FLOEFD models with measured device behavior.
Bond-line, pressure, and time-dependent behavior your TIM datasheet does not capture — and how to measure what matters.
Choosing between purpose-built electronics CFD and CAD-embedded simulation for different stages of the workflow.
Structure function measurement, RC network extraction, and importing validated thermal behavior into simulation.
Applying Power Tester and structure function monitoring to SiC, GaN, and IGBT device reliability programs.
How a combined simulation and test-based digital twin workflow reduced prototype loops on a high-density product.
Practical steps to move thermal decisions from post-prototype qualification into design and architecture.