Move from thermal assumptions to measured, simulation-ready evidence. Electro Source provides thermal model development, semiconductor thermal characterization, thermal interface material testing, and accelerated power semiconductor reliability testing — from early design through validation and qualification.
From IC packages and thermal interfaces to complete products, electronics systems and power semiconductor assemblies.
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Develop high-fidelity thermal models, identify thermal bottlenecks, and optimize product designs before physical prototypes are built.
Use non-destructive thermal transient testing to reveal internal heat-flow paths, thermal interfaces, and potential semiconductor failure points.
Measure the thermal conductivity and performance of greases, pastes, gap pads, fillers, phase-change materials, metals, and solid interfaces.
Use accelerated power cycling and real-time thermal monitoring to detect degradation, predict lifetime, and improve power semiconductor reliability.
Deliver reliable, high-performance products through predictive thermal design and shift thermal validation earlier in the product-development process.
Our thermal model development and analysis services combine high-fidelity digital twins, computational fluid dynamics, electronics cooling simulation, design-space exploration, and thermal optimization. We help engineering teams identify thermal bottlenecks before prototyping, balance thermal performance with mechanical and packaging constraints, and improve product reliability, performance, lifetime, cost, and manufacturability.
Gain deeper insight into semiconductor thermal performance through detailed, non-destructive thermal transient and structure function testing.
Our semiconductor component structure function testing reveals the thermal path from the semiconductor junction to ambient. The results help engineering teams identify thermal interfaces, detect thermal bottlenecks, find potential failure points, calibrate thermal simulation models, and improve device reliability without destructive teardown.
Obtain accurate thermal interface material data for simulation, supplier comparison, material selection, and product-reliability decisions.
Our thermal interface material characterization services measure thermal conductivity and interface performance across greases, pastes, gap pads, gap fillers, phase-change materials, metals, and solid interfaces. Validated material data helps engineering teams compare suppliers, improve CFD model accuracy, reduce contact-resistance uncertainty, and select materials based on evidence rather than datasheet assumptions.
Validate power semiconductor reliability and accelerate time to market through non-destructive accelerated power cycling and real-time thermal degradation monitoring.
Our power semiconductor accelerated failure analysis and reliability testing services reproduce real-world operating stress, perform millions of power cycles, monitor thermal resistance degradation, identify failure mechanisms, and support component lifetime prediction. This provides engineering teams with earlier evidence of power device, package, die-attach, interconnect, and thermal-interface reliability.
Our engineering services combine predictive simulation, measured thermal characterization, automated design exploration, and accelerated reliability testing.
Talk with our thermal engineering team about your design, characterization, material-testing, or reliability-validation requirements.
