Hardware and software as one thermal decision.

Semiconductor package thermal lifecycle

From first measured device to a screened production line, on one correlated thermal basis.

1. 01

   Measure and build the Compact Thermal Model

   Thermal transient testing of the packaged device produces structure functions, junction-to-case and junction-to-board resistances, and a DELPHI or two-resistor CTM.

   Simcenter Micred T3Ster
2. 02

   Simulate the system with the measured CTM

   The measured CTM drops into the board and enclosure model, so system-level predictions start from real device behaviour rather than a datasheet value.

   Flotherm
3. 03

   Finalize the design and build the prototype

   Airflow, spreading, and TIM decisions are settled against the correlated model before hardware is committed.

   FlothermHEEDS
4. 04

   Qualify reliability by power cycling

   Active power cycling with in-situ structure-function monitoring produces lifetime curves and degradation behaviour for the package.

   Simcenter Micred Power Tester
5. 05

   Screen 100% of units at production

   Every unit is measured against a golden structure function, so die-attach voids and delamination are caught before shipment.

   Simcenter Micred Industrial T3Ster

Degraded CTMs from power cycling feed back into simulation for end-of-life thermal prediction.

Power module qualification (AQG 324)

Automotive power module qualification with measurement, TIM data, and end-of-life simulation on one basis.

1. 01

   Establish the baseline

   Baseline Rth_jc and the initial structure function record the module's as-built thermal path before any stress is applied.

   Simcenter Micred T3Ster
2. 02

   Characterize the TIM in the real stack

   In-situ TIM measurement in the actual assembly stack-up replaces datasheet conductivity with the bond line the module really has.

   Simcenter Micred DynTIM
3. 03

   Run AQG 324 power cycling

   Power cycling with in-situ structure-function monitoring tracks bond-wire and solder degradation as it develops, not only at end of test.

   Simcenter Micred Power Tester
4. 04

   Simulate the end-of-life condition

   Aged thermal properties from the cycling data drive an end-of-life system simulation, so design margin reflects the module at the end of its service life.

   Flotherm

LED thermal design and lifetime prediction

Junction temperature governs flux, colour point, and lifetime — so the luminaire design starts from measured Tj.

1. 01

   Measure LED junction temperature and Rth

   Transient measurement separates the die, die-attach, and board contributions to the LED thermal path.

   Simcenter Micred T3Ster
2. 02

   Design the luminaire in CAD

   CAD-embedded thermal simulation evaluates housing, board spreading, and convection while the geometry is still moving.

   FLOEFD
3. 03

   Validate thermal fatigue life

   Power cycling establishes how the LED assembly degrades under real switching duty.

   Simcenter Micred Power Tester
4. 04

   Specify lumen maintenance and warranty

   Measured thermal and fatigue data support the lumen-maintenance projection and the warranty position behind it.

   Simcenter Micred T3Ster

EV battery thermal — cell to vehicle to reliability

Cell electrochemistry, pack and vehicle thermal behaviour, control strategy, and inverter reliability in one connected chain.

1. 01

   Model the cell

   Electrochemical-thermal simulation resolves heat generation and gradients inside the cell under charge and discharge.

   STAR-CCM+
2. 02

   Simulate pack and vehicle thermal behaviour

   System simulation carries cell behaviour up to the pack, cooling loop, and vehicle duty cycle.

   Amesim
3. 03

   Develop the BMS control strategy

   Hardware- and software-in-the-loop testing exercises thermal control strategy against the same plant model.

   Amesim
4. 04

   Qualify inverter reliability

   Power cycling qualifies the inverter power modules, with transient measurement characterizing the SiC or IGBT module before and after cycling.

   Simcenter Micred Power TesterSimcenter Micred T3Ster

Die-attach quality from R&D to production

One non-destructive measurement basis carried from the lab bench to the production line.

1. 01

   Establish the golden structure function

   Transient measurement of known-good parts defines the reference thermal path and reveals voids non-destructively.

   Simcenter Micred T3Ster
2. 02

   Define degradation thresholds

   Qualification cycling shows how far the structure function may shift before the joint is at risk, setting the pass/fail limit.

   Simcenter Micred Power Tester
3. 03

   Screen every unit in production

   Production screening compares each unit against the golden reference, with statistical process control tracking drift over time.

   Simcenter Micred Industrial T3Ster