- Who this is for
- Thermal Design EngineersSemiconductor Packaging EngineersReliability Engineers
- Industries
- SemiconductorsConsumer ElectronicsTelecom / 5GData CentersDefense Electronics
Structure-function measurement on the real package establishes junction-to-case resistance and the internal layer stack, while in-situ TIM characterization captures the interface as it is actually assembled. Those values calibrate the Flotherm model instead of being guessed from a datasheet, so board and enclosure predictions start from measured physics. HEEDS then explores heatsink geometry, airflow paths, and component placement across hundreds of variants, and the selected design is confirmed on Power Tester before release.
Design confidence from day one. Every model is validated. Every design is optimized. Every product is qualified.Discuss this workflow →