Skip to main content
01Solutions

Find your problem, not our product line.

Ten thermal engineering problems, described the way engineers actually search for them — each solved by combining Siemens Simcenter simulation with Simcenter Micred measurement in a correlated loop.
10 solutions

Electronics Cooling Simulation

Closing the gap between predicted and measured temperatures in electronics cooling design.

FlothermFLOEFDSimcenter Micred T3Ster
View solution →

PCB Thermal Analysis

Modelling real copper pour, via stitching and trace density instead of a simplified board.

FlothermFLOEFDSimcenter Micred T3Ster
View solution →

EV Battery Thermal Management

Cell-to-pack-to-vehicle thermal simulation connected to inverter reliability testing.

STAR-CCM+AmesimSimcenter Micred Power Tester
View solution →

Data Center Cooling Optimization

Rack-to-row-to-room airflow simulation for high-density and liquid-cooled data center design.

FlothermSTAR-CCM+Simcenter Micred T3Ster
View solution →

Liquid Cooling & Cold Plate Design

Cold plate and manifold thermal-hydraulic design validated against measured TIM and junction data.

STAR-CCM+FlomasterSimcenter Micred DynTIM
View solution →

Conjugate Heat Transfer Analysis

Coupled conduction-convection-radiation simulation for assemblies where the physics can't be separated.

FlothermFLOEFDSTAR-CCM+
View solution →

Thermal Reliability & Failure Prevention

Power cycling and structure-function monitoring to quantify degradation and predict remaining life.

Simcenter Micred Power TesterSimcenter Micred T3SterFlotherm
View solution →

Thermal Digital Twin

A thermal model kept accurate from concept through field operation with measured correlation at every stage.

FlothermSimcenter Micred T3SterSimcenter Micred Power Tester
View solution →

LED Thermal Design

Junction-temperature-driven LED thermal design validated against measured Tj and power-cycling fatigue data.

FLOEFDSimcenter Micred T3SterSimcenter Micred Power Tester
View solution →

High Power Density & Wide-Bandgap (SiC/GaN)

Thermal design and reliability qualification for wide-bandgap power devices at higher power density and junction temperature.

STAR-CCM+FlothermSimcenter Micred T3Ster
View solution →