Is a JEP30 PartModel the same thing as a JESD15-4 compact model?

No. JESD15-4 defines the compact thermal model methodology; JEP30 PartModel is the exchange format the resulting model — along with electrical and mechanical parameters — is packaged into.

Does this replace package-level thermal models?

No. Package-level models remain relevant for single-die and simpler packages. The chiplet-level model is additive, needed when a package integrates multiple die from potentially different suppliers.

How does this relate to Calibre 3DThermal?

Calibre 3DThermal supports die-level thermal simulation during design, which can inform the compact model extracted from measured T3Ster data. See the Calibre 3DThermal product page for details.

01JEDEC JEP30 PartModel / OCP CDXML

JEDEC JEP30 PartModel & OCP CDXML — chiplet thermal models

The May 2024 update to JEDEC JEP30's PartModel exchange format, alongside the Open Compute Project's chiplet CDXML format, extended part-model interchange to explicitly carry thermal properties for individual chiplets — not just electrical and mechanical parameters. This reflects the shift toward multi-die and chiplet-based packages, where system integrators need a thermal model for each chiplet rather than treating the package as a single thermal node.

When it takes effect

Published May 2024. OEM customers assembling multi-die packages are increasingly requesting a JEP30/CDXML-compliant thermal model as part of chiplet supplier qualification.

Who it affects

Chiplet and IP-block suppliers, and system integrators assembling multi-die packages, where the customer's design-in process expects a standardized, exchangeable thermal model per die.

What evidence satisfies it

A compact thermal model (JESD15-4-style BCI-ROM) for the chiplet, derived from measured structure functions and packaged in a JEP30 PartModel or OCP CDXML-compatible format.

02How that evidence is produced

This evidence is produced by measuring the chiplet's thermal transient response and extracting a compact model from it.

Product

Simcenter Micred T3Ster (BCI-ROM / JESD15-4 extraction)

View product →

Contracted alternative

Chiplet thermal model authoring and format packaging is available as a paid ROIfast™ engagement; die-level thermal simulation to support the model is available with Calibre 3DThermal.

03Frequently asked

Is your next qualification affected?

Tell us about your program and we'll help map it to the evidence this standard requires. Engineering work is delivered as a paid ROIfast™ engagement.

Talk to a Thermal Specialist →