Simcenter Micred DynTIM
Dynamic Thermal Interface Material Characterization — The Truth About Your TIM
Measure thermal interface material performance the way it actually behaves in your assembly — in-situ, with real surfaces, real pressures, and real bond-line thickness.
What It Is
ASTM D5470 measures TIM between idealized flat plates and yields the datasheet value. Simcenter Micred DynTIM measures TIM performance dynamically in the real assembly stack-up — real surfaces, real pressures, real bond-line thickness and real components — which is why in-situ results commonly differ 2–5× from the datasheet number.
Core Capabilities
Core capabilities
- In-situ TIM thermal resistance measurement using T3Ster transient methodology
- dynamic measurement under actual assembly conditions with real surfaces and real pressures
- structure-function separation isolating the TIM layer from the total thermal path
- bond-line thickness effect characterization
- TIM aging and pump-out monitoring over thermal cycling
- candidate comparison under identical conditions
- direct output of TIM thermal resistance for Flotherm and STAR-CCM+
- compatible with greases, pads, phase-change materials, gap fillers and soldered interfaces
Best For
- TIM selection and qualification
- Package-to-heatsink interfaces
- SiC and GaN power-module bond lines
- LED array assembly
- Incoming material qualification
Six-stage workflow position
Why engineering teams choose DynTIM.
Representative engineering situations these tools are asked to resolve.
- 01
A datasheet-published 5 W/m·K TIM measures at 2.7 W/m·K in the real assembly — DynTIM turns that datasheet gap into measured evidence your simulation model can use.
- 02
A power-module supplier changes TIM vendors mid-programme — DynTIM qualifies the substitute against the incumbent on identical fixtures before the change ships.
- 03
A heatsink clamp pattern looks acceptable in CAD but changes contact resistance across the module — DynTIM measures the actual stack-up response instead of relying on a flat-plate material value.
- In-situ TIM thermal resistance in the real assembly stack-up
- Measured TIM properties for Flotherm and STAR-CCM+ input
- Structure-function separation of the TIM layer from the total thermal path
- Repeatable bond-line and aging comparison on identical fixtures
- Materials engineer
- Package engineer
- Reliability engineer
In-situ measurement in the real stack-up
ASTM D5470 measures TIM between two idealized flat metal surfaces at controlled pressure and produces the datasheet value. Simcenter Micred DynTIM measures TIM performance dynamically in the actual assembly stack-up — with real surfaces, real pressures, real bond-line thickness and real components. The gap between the two can be 2–5×, which is why simulations built on datasheet TIM values frequently fail to match measured reality. DynTIM does not claim D5470 compliance; it provides the in-situ evidence needed when the product stack-up is what matters.
“Measuring thermal interface material performance in the actual assembly, rather than relying on datasheet values alone, has closed a long-standing gap between our simulations and measured results.”
Customer statement published by Siemens. Not an Electro Source engagement.
How this reaches your team.
Delivered by Electro Source with fixture setup, operator training, and traceable calibration support. ROIfast™ contract TIM characterization is available in our North American laboratory — including via our dedicated ROIfast site.
Discuss Your TIM Characterization Requirements
Tell us the TIM candidates, bond-line range, and the design or qualification decision the measurements need to support.