Innovator3D IC
3D-IC Architecture and Floorplanning Before Package Commitment
Where chiplets get placed, interposers get sized, and package thermal feasibility gets decided — before hundreds of engineer-months are committed.
What It Is
Innovator3D IC is the architecture-stage cockpit for chiplet-based packages. It brings thermal, power, and floorplan decisions into one place so the wrong architecture doesn't survive to physical implementation.
Core Capabilities
Chiplet placement and floorplanning
- Explore chiplet placement against thermal, power, and signal constraints.
- Evaluate interposer and substrate options at architecture stage.
- Feed hand-off data to Calibre 3DThermal for sign-off-grade analysis.
Early thermal feasibility
- Screen architectures against power maps and cooling budgets.
- Kill non-viable options before implementation.
- Compare package options — CoWoS, EMIB, InFO, organic substrate — on a common thermal basis.
Best For
- AI accelerator packages
- Chiplet-based server SoCs
- Automotive high-compute SoCs
- Advanced-package architecture studies
Six-stage workflow position
Why engineering teams choose Innovator3D IC.
Representative engineering situations these tools are asked to resolve.
- 01
An AI accelerator programme has three candidate chiplet floorplans — compute-adjacent HBM, compute-split HBM, and a rotated stack — and each advocate is arguing from a different spreadsheet. Innovator3D IC scores all three against the same 600 W power map and cooling budget in one session, and the option that looked best on signal length turns out to run 9 °C hotter at the hottest tile.
- 02
A package architect wants to move from organic substrate to a silicon interposer and needs more than a preference to justify roughly $2M in NRE. Innovator3D IC quantifies the junction-temperature delta at the same power map, turning the argument into a number the programme review can weigh against cost.
- 03
A multi-die automotive compute package must reserve escape routing for 4,000+ signals while keeping die-to-die junction gradients inside the AEC-Q100 grade-2 budget. Innovator3D IC compares floorplans before layout resources are committed, so the non-viable architecture is killed at week 3 rather than after four months of physical implementation.
- Feeds JEP30 / JESD15-4 model production downstream
- Package architect
- SoC architect
- Thermal engineer
How this reaches your team.
Delivered by Electro Source with architecture-workshop setup and downstream Calibre 3DThermal handoff configuration.
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Discuss Your 3D-IC Architecture
Tell us the chiplet count, package option, and the architecture decision Innovator3D IC needs to support.