6 capabilities · 12 products
Purpose-built CFD for electronics cooling from PCB to full rack. Best fit when thermal specialists own the model.
Thermal and flow analysis inside NX, Solid Edge, or Creo. Best fit when mechanical designers need to run studies without leaving CAD.
Automated exploration of hundreds of design variants against thermal, weight, cost, and packaging targets. Works as a cross-stage optimization layer.
System-level fluid network modeling for liquid cooling loops, pump sizing, and coolant path tradeoffs.
Die-level and 3D IC thermal analysis inside the IC design flow. Expose junction hotspots before floorplan freeze.
Advanced 3D IC / chiplet package architecture and floorplanning, coupled with Calibre 3DThermal for early thermal signoff.
Enterprise PCB design that feeds directly into Flotherm and FLOEFD for concurrent thermal / layout decisions.
Non-destructive junction-to-ambient thermal characterization and structure-function extraction for packaged devices.
Measure thermal conductivity of greases, gap pads, phase-change, and metal TIMs under realistic bond-line and pressure.
Accelerated power-cycling with in-situ structure-function monitoring for SiC, GaN, and IGBT lifetime prediction.
Combined thermal and radiometric / photometric characterization of high-power LEDs, paired with T3Ster.
Fixed-scope, fixed-timeline thermal engineering delivered by ESI specialists — model authoring, correlation, optimization.
