Chiplet/Die
- Who This Helps
- IC designer
- Design Tool
- Die design and verification
- Thermal Solution
- Calibre 3DThermal
Open any stage to see who it helps, the design and thermal solutions involved, the engineering challenge it addresses, and the earlier design decision it enables.

Every downstream thermal decision inherits from what happens at the die. Chiplet architecture, power maps, and floorplan choices set the junction temperature envelope and dictate what the package, board, and enclosure must dissipate. Calibre 3DThermal makes this visible to IC designers early — before package and board assumptions are locked and before thermal risk becomes a downstream constraint.
Open the matching capability or product card on the Capabilities page.
The strongest thermal workflows connect simulation and test. Measured thermal data improves model accuracy. Improved models guide better design decisions. Better design decisions reduce prototype loops, qualification risk, and field reliability issues.
Electro Source supports simulation, physical characterization, model correlation, optimization, and validation across the Siemens thermal workflow.
Most vendors sell simulation. Some sell measurement. Electro Source delivers the loop between them — simulation, measurement, reliability, and production QC from one partner, on one correlated basis. That correlation is where accuracy comes from.
Measure the thermal transient response of the real device
Output: Structure functions, Rth, Zth, Compact Thermal Models
Characterize TIM performance in the real assembly stack-up
Output: In-situ TIM thermal resistance for simulation input
Import CTMs and TIM data into thermal simulation
Output: Measurement-validated system thermal model
Simulate and optimize the complete thermal design
Output: Optimized solution, correlated against measurement
Power cycle devices to evaluate thermal reliability
Output: Lifetime curves, degradation maps, Weibull data
Calibrate simulation for end-of-life thermal conditions
Output: Design margins that account for aging and degradation
Screen every unit at production for thermal defects
Output: 100% quality gate, zero-defect outgoing product