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00One Connected Thermal Workflow

From chiplet to system of systems — one thermal workflow.

From chiplet and die to package, PCB, enclosure, rack, system, and system-of-systems, Siemens Simcenter helps engineering teams connect thermal simulation, physical testing, and validated data into one engineering workflow.
6 stages · Chiplet → System of Systems · Flotherm · FLOEFD · Flomaster · Calibre 3DThermal · T3Ster · DynTIM · Power Tester
01Chiplet to System of Systems
01Stage

Chiplet/Die

Who This Helps
IC designer
Design Tool
Die design and verification
Thermal Solution
Calibre 3DThermal
Engineering Challenge
Junction temperature, die-level heat concentration, early thermal constraints
Design Decision Enabled
Understand heat-source behavior before package and board assumptions are locked.
02Stage

Substrate/Package

Who This Helps
3D IC Package Lead / Package Architect
Design Tool
Package floorplanning, Innovator3D IC
Thermal Solution
Calibre 3DThermal with Innovator3D IC
Engineering Challenge
Package thermal resistance, thermal stack-up uncertainty, package-to-system mismatch
Design Decision Enabled
Evaluate package architecture before it becomes a downstream board or system constraint.
03Stage

PCB

Who This Helps
PCB designer
Design Tool
Xpedition
Thermal Solution
Simcenter Flotherm / FLOEFD
Engineering Challenge
Component placement, copper distribution, spacing, local hotspots, airflow assumptions
Design Decision Enabled
Adjust board-level thermal choices before physical layout decisions become expensive.
04Stage

Enclosure/Rack

Who This Helps
Mechanical / thermal engineer
Design Tool
Mechanical design tools such as NX and Solid Edge
Thermal Solution
Simcenter Flotherm / FLOEFD
Engineering Challenge
Enclosure geometry, airflow path, fan selection, heatsink sizing, mechanical packaging limits
Design Decision Enabled
Validate cooling architecture before enclosure design is frozen.
05Stage

System

Who This Helps
Mechanical / thermal engineer
Design Tool
Mechanical design tools such as NX and Solid Edge
Thermal Solution
Simcenter Flotherm / FLOEFD / Flomaster
Engineering Challenge
System cooling, derating, liquid cooling, thermal interaction between subsystems
Design Decision Enabled
Compare cooling tradeoffs before qualification or production issues appear.
06Stage

System of Systems

Who This Helps
Systems engineering and product engineering leadership
Design Tool
System architecture and product engineering workflows
Thermal Solution
Simcenter Flotherm / FLOEFD / Flomaster
Engineering Challenge
Full product thermal reliability, field performance, system-level margin, cross-subsystem interaction
Design Decision Enabled
Build confidence across the complete product architecture.
02Explore Each Stage

Chiplet/Die — Thermal Ownership Starts at the Heat Source

Thermal Ownership Starts at the Heat Source

Calibre 3DThermal

Every downstream thermal decision inherits from what happens at the die. Chiplet architecture, power maps, and floorplan choices set the junction temperature envelope and dictate what the package, board, and enclosure must dissipate. Calibre 3DThermal makes this visible to IC designers early — before package and board assumptions are locked and before thermal risk becomes a downstream constraint.

Who This Helps
IC designer
Design Tool
Die design and verification
Thermal Solution
Calibre 3DThermal
Engineering Challenge
Junction temperature, die-level heat concentration, early thermal constraints
Design Decision Enabled
Understand heat-source behavior before package and board assumptions are locked.
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03 · Closed Loop

Closed simulation and testing loop.

The strongest thermal workflows connect simulation and test. Measured thermal data improves model accuracy. Improved models guide better design decisions. Better design decisions reduce prototype loops, qualification risk, and field reliability issues.

Electro Source supports simulation, physical characterization, model correlation, optimization, and validation across the Siemens thermal workflow.

04The Loop, Step by Step

Seven steps from measured device to screened production unit.

Most vendors sell simulation. Some sell measurement. Electro Source delivers the loop between them — simulation, measurement, reliability, and production QC from one partner, on one correlated basis. That correlation is where accuracy comes from.

  • Step 01

    Measure the thermal transient response of the real device

    Output: Structure functions, Rth, Zth, Compact Thermal Models

  • Step 02

    Characterize TIM performance in the real assembly stack-up

    Output: In-situ TIM thermal resistance for simulation input

  • Step 03

    Import CTMs and TIM data into thermal simulation

    Output: Measurement-validated system thermal model

  • Step 04

    Simulate and optimize the complete thermal design

    Output: Optimized solution, correlated against measurement

  • Step 05

    Power cycle devices to evaluate thermal reliability

    Output: Lifetime curves, degradation maps, Weibull data

  • Step 06

    Calibrate simulation for end-of-life thermal conditions

    Output: Design margins that account for aging and degradation

  • Step 07

    Screen every unit at production for thermal defects

    Output: 100% quality gate, zero-defect outgoing product