Simcenter Micred Industrial T3Ster
Production-Line Thermal Testing — 100% Quality at Manufacturing Speed
T3Ster precision on the factory floor — 100% non-destructive thermal quality inspection at manufacturing speed.
What It Is
Industrial T3Ster brings T3Ster's transient-measurement precision to the production line. Every unit gets a non-destructive structure-function inspection — die-attach voids, solder defects, TIM failures and assembly anomalies caught at production speed, not in the field.
Core Capabilities
Core capabilities
- Production-speed thermal transient measurement and structure-function analysis
- automated pass/fail classification against a golden-sample reference
- non-destructive die-attach void and solder quality inspection
- integration with production test handlers and ATE
- SPC with real-time trend monitoring
- batch testing and lot qualification reporting
- go/no-go thermal screening for 100% outgoing quality
- rack-mounted factory-floor form factor
- remote monitoring and data logging via network connectivity
Best For
- Semiconductor packaging production lines
- Power-module manufacturing
- LED assembly and binning
- Automotive electronics production quality
- Die-attach process monitoring
- Incoming and outgoing quality control
Six-stage workflow position
Production-side measurement layer for 100% outgoing thermal quality — the factory-floor counterpart to T3Ster in the lab.
Why engineering teams choose Industrial T3Ster.
Representative engineering situations these tools are asked to resolve.
- 01
A power-module manufacturer catches die-attach voids only at customer failure analysis — Industrial T3Ster screens 100% of outgoing units at line rate and traces process drift back to the die-attach cell.
- 02
An LED production line samples 1-in-1000 for thermal quality and misses a solder-void excursion — Industrial T3Ster inspects every unit non-destructively and holds the lot before it ships.
- 03
A Tier-1 supplier is asked to replace C-SAM and X-ray die-attach inspection with a faster, non-destructive method — Industrial T3Ster meets the throughput and produces SPC-ready data.
- JEDEC JESD51 methodology at production speed
- SPC-compatible output
- Manufacturing engineer
- Production quality manager
- Process engineer
- Test engineer
“Non-destructive thermal screening at production speed has let us catch die-attach and TIM defects that our previous inspection methods were missing.”
Customer statement published by Siemens. Not an Electro Source engagement.
How this reaches your team.
Delivered by Electro Source with handler and ATE integration, golden-sample calibration, SPC configuration and operator training. Pilot-line evaluation available before full production rollout.
Discuss Your Production-Line Thermal Screening
Tell us the product, line throughput, and the quality escape or process signal you need Industrial T3Ster to catch.